
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/10/13
TVS Diode Arrays (SPA
®
Diodes)
General Purpose ESD Protection - SP1002 Series
Package Dimensions — SC70-3
B
3
E
HE
2
1
e
e
D
A2
A
A1
C
L
1.30
[0.0512]
0.65
[0.0256]
0.70
[0.0276]
1.90
[0.0748]
0.90
[0.0354]
Package SC70-3
Pins 3
JEDEC MO-203
Millimeters Inches
Min Max Min Max
A 0.80 1. 10 0.031 0.043
A1 0.00 0.10 0.000 0.004
A2 0.70 1. 0 0 0.028 0.039
B 0.15 0.30 0.006 0.012
c 0.08 0.25 0.003 0.010
D 1.85 2.25 0.073 0.089
E 1. 15 1.35 0.045 0.053
e 0.66 BSC 0.026 BSC
HE 2.00 2.40 0.079 0.094
L 0.26 0.46 0.010 0.018
Solder Pad Layout
Package Dimensions — SC70-5
D
A2
A
A1
C
L
E
HE
2
1
3
6
5
not used
4
e
e
B
Package SC70-5
Pins 5
JEDEC MO-203
Millimeters Inches
Min Max Min Max
A 0.80 1. 10 0.031 0.043
A1 0.00 0.10 0.000 0.004
A2 0.70 1. 0 0 0.028 0.039
B 0.15 0.30 0.006 0.012
c 0.08 0.25 0.003 0.010
D 1.85 2.25 0.073 0.089
E 1. 15 1.35 0.045 0.053
e 0.65BSC 0.026 BSC
HE 2.00 2.40 0.079 0.094
L 0.26 0.46 0.010 0.018
Solder Pad Layout
Product Characteristics
Lead Plating MatteTin
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material MoldedEpoxy
Flammability UL 94 V-0
Notes:
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3.Dimensionsareexclusiveofmoldash&metalburr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5.PackagesurfacemattenishVDI11-13.
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