Littelfuse SL1122 Series Bedienungsanleitung PDF herunterladen (Seite 3)

Gas Discharge Tube (GDT) Products

Speciﬁcations are subject to change without notice.

Revised: 01/08/14

SL1122A Series

Reﬂow Condition Pb-freeassembly

Pre Heat

- Temperature Min (T

s(min)

) 150°C

- Temperature Max (T

s(max)

) 200°C

- Time (Min to Max) (t

) 60–180seconds

Average Ramp-up Rate (Liquidus Temp

) to peak)

3°C/secondmax.

S(max)

to T

- Ramp-up Rate 5°C/secondmax.

Reﬂow

- Temperature (T

) (Liquidus) 217°C

- Temperature (t

) 60–150seconds

Peak Temperature (T

) 260

+0/-5

°C

Time within 5°C of Actual Peak

Temperature (t

)

10–30seconds

Ramp-down Rate 6°C/secondmax.

Time 25°C to Peak Temperature (T

) 8minutesmax.

Do not exceed 260°C

Soldering Parameters - Reﬂow Soldering

Time

Temperature

S(max)

S(min)

time to peak temperature

(t 25ºC to peak)

Ramp-down

Ramp-up

Preheat

Critical Zone

to T

Soldering Parameters - Wave Soldering (Thru-Hole Devices)

Soldering Parameters - Hand Soldering

Dwell Time

100

120

140

160

180

200

220

240

260

280

300

100

110

120

130

140

150

160

170

180

190

200

210

220

230

240

Time (Seconds)

Temperature (°C) - Measured on bottom side of board

Cooling Time

Preheat Time

Wave Parameter Lead-Free Recommendation

Preheat:

(DependsonFluxActivationTemperature)

(TypicalIndustryRecommendation)

TemperatureMinimum:

100

°C

TemperatureMaximum:

150

°C

PreheatTime: 60-180seconds

Solder Pot Temperature:

280

°CMaximum

Solder Dwell Time: 2-5seconds

Recommended Process Parameters:

SolderIronTemperature:350°C+/-5°C

HeatingTime:5secondsmax.

*Devicesthataresolderedrequireinspectionbeforeuse.

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