
110
Revised: July 12, 2010
POLYFUSE
®
Resettable PTCs
© 2010 Littelfuse, Inc.
600R Series
Radial Leaded > 600R Series
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/600R.html for current information.
Part Ordering Number System
R: RADIAL
I
HOLD
CURRENT CODE (SEE TABLE BELOW)
600 R 160 - RA F
QUANTITY CODE: F=200 U=500 Z = 600
SERIES
PEAK VOLTAGE RATING
Rx:
Resistance Range (x = A-Z or 1-9) [not applicable for all
PACKAGING STYLE
BLANK: Bulk
R: Tape & Ammo
Environmental Specifications
Operating/Storage
Temperature
-40°C to +85°C
Maximum Device Surface
Temperature in Tripped State
125°C
Passive Aging 85°C/85°C, 1000 hours
Humidity Aging +85°C, 85% R.H.,1000 hours
Thermal Shock
MIL–STD–202F, Method 107G
+125°C to -55°C 10 times
Solvent Resistance MIL–STD–202, Method 215F
Physical Specifications
Lead Material Tin-plated Copper
Soldering
Characteristics
Solderability per MIL–STD–202,
Method 208E
Insulating Material
Cured, flame retardant epoxy polymer
meets UL94V-0 requirements.
Device Labeling
Marked with ‘LF’, voltage, current rating,
and date code.
Soldering Parameters - Solder Reflow
Condition Reflow
Peak Temp/ Duration Time 260°C
>
5 Sec
>
220°C 30 Sec ~ 60 Sec
Preheat 160°C~ 190°C 60 Sec ~ 90 Sec
Storage Condition 0°C~35°C,
70%RH
t3FDPNNFOEFESFnPXNFUIPET*3WBQPSQIBTFPWFOIPU
air oven, N
2
environment for lead-free.
t%FWJDFTBSFOPUEFTJHOFEUPCFXBWFTPMEFSFEUPUIF
bottom side of the board.
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and solvents.
Note: If reflow temperatures exceed the recommended
profile, devices may not meet the performance
requirements.
Preheating
160
190
220
260
0
30 to 60
Temperature (°C)
Soldering Cooling
120
60 to 90
Time(s)
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