
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 02/20/14
Surface Mount Fuses
NANO
2®
> Very Fast-Acting > 451/453 Series
Average Time Current Curves
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (Min to Max) (t
s
) 60 – 120 secs
Average ramp up rate (Liquidus Temp
(T
L
) to peak
5°C/second max.
T
S(max)
to T
L
- Ramp-up Rate 5°C/second max.
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 90 seconds
Peak Temperature (T
P
) 260
+0/–5
°C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 5°C/second max.
Time 25°C to peak Temperature (T
P
) 8 minutes max.
Do not exceed 260°C
Soldering Parameters
Temperature Rerating Curve
0.001
0.01
0.1
1
10
100
0.01 0.1 1 10 100 1000 10000
TIME IN SECONDS
CURRENT IN AMPS
8A
10A
12A
5A
6.3A
7A
15A
3.5A
3.15A
3A
4A
2.5A
2A
1.5A
1.25A
1A
800mA
750mA
630mA
500mA
Note:
1. Deratingdepictedinthiscurveisinadditiontothestandardderatingof25%for
continuous operation.
Wave Soldering Parameters
260°CPeak
Temperature,
10 seconds max.
Time
Temperature
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
T
L
to T
P
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