Littelfuse 3.0SMC Series Bedienungsanleitung PDF herunterladen (Seite 4)

Transient Voltage Suppression Diodes

© 2014 Littelfuse, Inc.

Speciﬁcations are subject to change without notice.

Revised: 01/24/14

Surface Mount > 3.0SMC Series

TVS Diode Arrays (SPA

™

Family of Products)

Physical Speciﬁcations

Weight 0.007 ounce, 0.21 grams

Case

JEDEC DO214AB. Molded plastic body

over glass passivated junction

Polarity

Color band denotes positive end

(cathode) except Bidirectional.

Terminal

Matte Tin-plated leads, Solderable per

JESD22-B102

Dimensions

Dimensions

Inches Millimeters

Min Max Min Max

A 0.114 0.126 2.900 3.200

B 0.260 0.280 6.600 7. 11 0

C 0.220 0.245 5.590 6.220

D 0.079 0.103 2.060 2.620

E 0.030 0.060 0.760 1.520

F - 0.008 - 0.203

G 0.305 0.320 7.750 8.130

H 0.006 0.012 0.152 0.305

I 0.129 - 3.300 -

J 0.094 - 2.400 -

K - 0.165 4.200

L 0.094 - 2.400 -

Soldering Parameters

Temperature (T)

Time (t)

T

s(min)

T

s(max)

T

L

T

P

t

s

Preheat

t

L

t

p

Ramp-up Critical Zone

T

L

to

T

P

Ramp-down

t 25˚C to Peak

25˚C

Reﬂow Condition Lead–free assembly

Pre Heat

- Temperature Min (T

s(min)

) 150°C

- Temperature Max (T

s(max)

) 200°C

- Time (min to max) (t

s

) 60 – 180 secs

Average ramp up rate (Liquidus Temp

(T

L

) to peak

3°C/second max

T

S(max)

to T

L

- Ramp-up Rate 3°C/second max

Reﬂow

- Temperature (T

L

) (Liquidus) 217°C

- Time (min to max) (t

s

) 60 – 150 seconds

Peak Temperature (T

P

) 260

+0/-5

°C

Time within 5°C of actual peak

Temperature (t

p

)

20 – 40 seconds

Ramp-down Rate 6°C/second max

Time 25°C to peak Temperature (T

P

) 8 minutes Max.

Do not exceed 280°C

(all dimensions in mm)

I

L

K

J

Solder Pads

Environmental Speciﬁcations

High Temp. Storage JESD22-A103

HTRB JESD22-A108

Temperature Cycling JESD22-A104

MSL JEDEC-J-STD-020, Level 1

H3TRB JESD22-A101

RSH JESD22-B106

DO-214AB (SMC J-Bend)

B

F

G

H

E

C

D

A

Cathode Band

1 2 3 4 5

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