Littelfuse 269 Series MICRO Bedienungsanleitung PDF herunterladen (Seite 2)

Speciﬁcations are subject to change without notice.

Revised: 12/19/13

Radial Lead Fuses

MICRO™ > Very Fast-Acting > 262/268/269 Series

Temperature Rerating Curve

Soldering Parameters - Wave Soldering

Dwell Time

100

120

140

160

180

200

220

240

260

280

300

100

110

120

130

140

150

160

170

180

190

200

210

220

230

240

Time (Seconds)

Temperature (°C) - Measured on bottom side of board

Cooling Time

Preheat Time

Wave Parameter Lead-Free Recommendation

Preheat:

(Depends on Flux Activation Temperature)

(Typical Industry Recommendation)

Temperature Minimum:

100

° C

Temperature Maximum:

150

° C

Preheat Time: 60-180 seconds

Solder Pot Temperature:

260

° C Maximum

Solder Dwell Time: 2-5 seconds

Recommended Hand-Solder Parameters:

Solder Iron Temperature: 350° C +/- 5°C

Heating Time: 5 seconds max.

Note: These devices are not recommended for IR or

Convection Reﬂow process.

Recommended Process Parameters:

Please contact Littelfuse for average time current curve.

Additional Information

Datasheet

Samples

Resources

Datasheet

Samples

Resources

Datasheet

Samples

Resources

262 Series

268 Series

262 Series

268 Series

262 Series

268 Series

269 Series

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